Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
| Techinical Parameter | |
| Travel Stroke [mm] | 7-100um |
| Repeatability [%F.S] | 0.05 |
| Max Payload Fz [N] | 100-30000N |
| Piezo Rated Votage [VDC] | 0-150 |
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
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