Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.

Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.

Micron-level capability, perfectly suited for laser precision machining scenarios.

Micron-level capability, perfectly suited for laser precision machining scenarios.

Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.