Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
| Mechanical Parameter | Leadscrew Pitch [mm] | ||||
| 0.25 | 0.4 | 0.5 | 0.8 | 1.0 | |
| Repeatability [±um] | 0.06 | 0.1 | 0.13 | 0.2 | 0.25 |
| Travel Stroke [mm] | 5.5 | 5.5 | 5.5 | 10 | 15 |
| Max Speed without payload [mm/s] | 0.6 | 0.9 | 1.1 | 1.8 | 2.3 |
| Max Payload Fx [N] | 30 | 30 | 30 | 30 | 30 |
| Max Payload Fy [N] | 45 | 45 | 45 | 45 | 45 |
| Max Payload Fz [N] | 70 | 70 | 70 | 70 | 70 |
| Electrical Parameter | Stepper Motor | ||||
| Motor Step Angle [°] | 15 | ||||
| Motor Rated Current[A] | 0.25 | ||||
| Motor Resistance [Ohm] | 12.5 | ||||
| Motor Inductance [mH] | 6.3 | ||||
| Motor Gear Ratio | 28:1 | ||||
| Limit Switches | Hall Sensor | ||||
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
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