Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.

Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
| Mechanical Parameter | Leadscrew Pitch[mm] | ||||
| 0.25 | 0.4 | 0.5 | 0.8 | 1.0 | |
| Repeatability [±um] | 0.06 | 0.1 | 0.13 | 0.2 | 0.25 |
| Travel Stroke [mm] | 5.5 | 5.5 | 5.5 | 10 | 15 |
| Max Speed without payload [mm/s] | 0.8 | 1.2 | 1.5 | 2.4 | 3 |
| Max Payload Fx [N] | 35 | 35 | 35 | 35 | 35 |
| Max Payload Fy [N] | 50 | 50 | 50 | 50 | 50 |
| Max Payload Fz [N] | 80 | 80 | 80 | 80 | 80 |
| Electrical Parameter | Servo Motor | ||||
| Motor Rated Power [W] | 5 | ||||
| Motor Rated Current [A] | 0.35 | ||||
| Motor Reted Voltage [V DC] | 5-28 | ||||
| Motor Gear Ratio | 30:1 | ||||
| Limit Switches | Hall Sensor | ||||
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.
Achieving a repeated positioning accuracy of ±0.1μm, optimized specifically for wafer inspection equipment.

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